Accelerating Plating Cycles and Reducing Costs: Improving the Plating of High Aspect Ratio Holes & Blind Vias
This paper describes a new technology for speeding the initiation and uniformity ofelectroplating
deposits that does not depend on modifying the chemistry or physical environment ofthe plating bath.
Rather, it involves the treatment of conductive surfaces outside of/he plming environment and is therefore
not dependant all any particular type of bath, the pH of the bath, or the chemical agents contained in the
bath_ Process improvements include a more rapid initiation of plating; an increase in "throwing po....er"
into low current density areas; and improved mctal·to-mctal bonding such that very thin deposits exhibit
unusual resistance to corrosive testing environments.
James Taylor, Duratech Industries, Inc.