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A High Resolution, Positive Working Dry Film Photoresist $60.00

Winter 1998

A High Resolution, Positive Working Dry Film Photoresist

Abstract A positive work" g dry film photoresist designed for either acid etch r electroplating applications is presented. 5 Jlm / 5 Jlm reso ution, with a corresponding aspect ratio of 6.6:1, i demonstrated. Processing is by conventional wet la ination, exposure, development and stripping. Deve opment requires an aqueous, dilute triethanolamin solution. In addition to conventional electroplating methods, the resist is capable of multiple exposure ased processing allowing for an iterative, photo def .tion of desired plated features.

Thomas A. Koes and Stephen H. Wheeler, Morton Electronic Materials

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