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The Development of a Molded Array SMCSP Package Using High-Densi $60.00

September 2001

The Development of a Molded Array SMCSP Package Using High-Density Type Lead Frame

Sang Kyun Lee, Han Gyu Kim, Bong Hi Lee, and Kwang Suck Park, Precision Instrument R&D Center, Samsung Techwin Company, Ltd.

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