Winter 1998
A High Resolution, Positive Working Dry Film Photoresist
Abstract
A positive work” g dry film photoresist designed
for either acid etch r electroplating applications is
presented.
5 Jlm / 5 Jlm reso ution, with a corresponding aspect
ratio of 6.6:1, i demonstrated. Processing is by
conventional wet la ination, exposure, development
and stripping. Deve opment requires an aqueous, dilute
triethanolamin solution. In addition to conventional
electroplating methods, the resist is capable of
multiple exposure ased processing allowing for an
iterative, photo def .tion of desired plated features.
Thomas A. Koes and Stephen H. Wheeler, Morton Electronic Materials
