Heat Plates, Ladders and Sinks by Photochemical Milling
Winter 1984
Trends toward miniaturisation with greater density of components on
PCBs has inevitably led to the generation of unwanted heat. For
components to function efficiently it is essential to remove the heat before it reaches levels which affect performance. One of the most successful ways of achieving this dissipation is by building into the device a ‘heat
sink’-a substantial metal plate in close conlact with components
producing the heal-to conduct it rapidly away to uncritical areas from
where it can be removed by forced air cooling circulation . To achieve
maximum dissipation the plates must be accurately profiled often into
very intricate shapes, and sometimes even rebated to allow components to fit into the thickness of the metal. The plates must have no burrs or
stresses introduced by their means of manufacture. Areas underneath
components must remain flat so that the plate has complete contact at the interface.
Paul Cane, Tecan Components
