Semiconductor to PWB: Bridging the Imaging Gap

Summer 1997

Semiconductor to PWB: Bridging the Imaging Gap

Pushing the limits of technology has always been a criterion of the electronics industry. Making devices smaller and more powerful has driven the industry into a technology frenzy with the boundaries and limits being broken and redefined as quickly as they are set up. The excitement of this fervor for size and power has caused most of the paradigms to be sought out and extinguished. Some of the dinosaurs still exist in the realm of eleclronics, but most are on their way to extinction. One of the splits in technology that still remains is the gap that exists between semiconductor and PWB imaging. The bridging of this gap is happening on several fronts. It is happening in both the PWB and lead frame manufacturing fields. As PWB manufactured rush to evolve chip on board, BGA, etc. technologies, lead frame manufacturers push for the 300 plus pin count lead frame. Both technologies are requiring imaging dimensions that were unheard of only five years ago.

Ken Bridges, Morton Electronic Materials
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