Dry Film Imaging Considerations for Photochemical Machining

March 2009

Dry Film Imaging Considerations for Photochemical Machining

Adhesion is the key to the successful etching of photochemical machining parts with dry ilm photoresist. Speciically, the imaging process must be optimized to gain suficient attachment between the dry ilm and the metal surface to ensure survival through the inal etching process. Total dry ilm adhesion consists of both chemical and mechanical components. Unfortunately, dry ilm can only chemically complex via its acid chelation system with copper and copper-based alloys. So, we must focus on mechanical means to get the dry ilm to adhere to most common photochemical machining substrates.

Bill Wilson, DuPont Electronics