Dry Film Imaging Considerations for Photochemical Machining

Adhesion is the key to the successful etching of photochemical machining parts with dry film photoresist. Specifically, the imaging process must be optimized to gain sufficient attachment between the dry film and the metal surface to ensure survival through the final etching process. Total dry film adhesion consists of both chemical and mechanical components. Unfortunately, dry film can only chemically complex via its acid chelation system with copper and copper-based alloys. So, we must focus on mechanical means to get the dry film to adhere to the most common photochemical machining substrates.