March 2009
Dry Film Imaging Considerations for Photochemical Machining
Adhesion is the key to the successful etching
of photochemical machining parts with dry ilm
photoresist. Speciically, the imaging process must
be optimized to gain suficient attachment between
the dry ilm and the metal surface to ensure survival
through the inal etching process. Total dry ilm
adhesion consists of both chemical and mechanical
components. Unfortunately, dry ilm can only
chemically complex via its acid chelation system with
copper and copper-based alloys. So, we must focus
on mechanical means to get the dry ilm to adhere to
most common photochemical machining substrates.
Bill Wilson, DuPont Electronics
