Dry Film Imaging Considerations for Photochemical Machining

March 2009

Dry Film Imaging Considerations for Photochemical Machining

Adhesion is the key to the successful etching

of photochemical machining parts with dry film

photoresist. Specifically, the imaging process must

be optimized to gain sufficient attachment between

the dry film and the metal surface to ensure survival

through the final etching process. Total dry film

adhesion consists of both chemical and mechanical

components. Unfortunately, dry film can only

chemically complex via its acid chelation system with

copper and copper-based alloys. So, we must focus

on mechanical means to get the dry film to adhere to

the most common photochemical machining substrates.

Bill Wilson, DuPont Electronics