Effects of Mixing of Air with Etching Solution on Characteristics of Spray Etching
Fall 1985
Introduction –
It is an old and a new problem to be solved to reduce the side
etch as small as possible in the photo chemical machining.
Several countermeasures for reducing the side etch, for
example, increasing the adherence between a photoresist and a
work material, increasing a spray pressure, selection and
adjustment of a spray nozzle, increasing the concentration of an
etching solution etc. have been trying in a long period. But there
are hardly epochmaking countermeasures to reduce the side
etch. While the powderless etching processes are useful for
specified materials, it has not become a usual process for the
common materials used generally in the photo chemical
machining.
In this research, a spray etching method in which a
compressed air is mixed into the etching solution was tried and
the effects of the mixing of air on the etching characteristics of
the spray etching, especially, on the etch rate and the side etch
were studied.
Dr. Toshikazu Sato and Dr. Yoshimi Takasashi, Hokkaido University
