June 2004
Half Etch Technology for Fine Line Processing
HOI (High Density Interconnects) and ultra fine
lines are becoming more and more popular. The
use of ultra thin foils is the only feasible way to
produce ultra fine lines in a production environment.
Half etching (copperrcduction) is the
easiest and most economical way to produce thin
foils. This paper will discuss the half etching
process, the equipment used for the process,
testing results, and the advantages ofhatf
etching.
Randall Markle, Chemcut Corporation
