March 2004
High Density Circuit Roadmap for Electronic Packaging Materials
Historically, during the 1960s to the 19705, most
semiconductors were packaged in DIP (Dual
lnline Packages), and they were mounted on
rigid circuit boards (Figure 1). The bare dies
were mounted on lead frames and connected by
wire bonding. The component leads were
inserted in the through holes of the circuit
boards and soldered at the other side of the
boards.
Dominique Numakura, DKN Research
