High Resolution Dry Film Imaging for Photochemical Machining

Summer 1988

High Resolution Dry Film Imaging for Photochemical Machining

Most current dry film photoresists are capable of achieving accurate 3 mil line and space imaging resolution, when using modem processing equipment and careful process control. Certain.special dry film types can resolve geometries down to as little as 1 mil lines and spaces. Thus, the major limiting factors in producing high resolution images with dry film have proven to be process-related, not photographic limitations in the dry film itself. Specifically, use of equipment capable of high intensity exposure and high impact spray development is particularly important.

Wiliam L. Wilson, E.I. DuPont De Nemours and Company, Inc.