Summer 1988
High Resolution Dry Film Imaging for Photochemical Machining
Most current dry film photoresists are capable of achieving
accurate 3 mil line and space imaging resolution, when using
modem processing equipment and careful process control.
Certain.special dry film types can resolve geometries down to as
little as 1 mil lines and spaces. Thus, the major limiting factors in
producing high resolution images with dry film have proven to
be process-related, not photographic limitations in the dry film
itself. Specifically, use of equipment capable of high intensity
exposure and high impact spray development is particularly
important.
Wiliam L. Wilson, E.I. DuPont De Nemours and Company, Inc.
