Leadframe Chip Scale Packaging – Many New Packages, Many Expectations

September 2004

Nelson Fan, Vice President of Engineering, ASAT Holdings, Ltd., Hong Kong, China, and Neil McLellan, Chief Technology Officer, ASAT Inc., Pleasanton, CA, USA

The proliferation of new packaging families and variations is more rapid today than ever before. Demands on cost, performance, density, and
matching to specific chip technologies or appli­cations present the IDM designer with an ever­widening pallet of choices. While this is good from a cost/performance perspective and allows the designer to select an optimum solution, it also introduces some level of confusion. Many of the new packages appear similar upon cursory examination yet often present widely different expectations, depending on the construction
technique and the required application.