Mass Production of Microdevices with Extreme Aspect Ratios by Electroforming
A new technology (L1GA)- for fabricating microdevices is
being developed at the Karlsruhe Nuclear Research Center, West
Germany.l In the UGA process, synchrotron radiation lithography,
electroforrning, and plastic molding are employed as
structure-generating techniques. Synchrotron radiation lithography
and plastic molding serve to produce plastic microdevices;
metallic microdevices are fabricated exclusively by electroforming?
Microdevices with dimensions in the submicrometer
range can be produced by UGA and thus correspond to the
smallest devices used in modem semiconductor circuits. Heights
to 0.5 mm can be achieved with height-to-width aspect ratios of
100:1000. Another characteristic of these microdevices is the
exact parallelism of the structural walls.
A. Maner, Karlsruhe Nuclear Research Center, and S. Harsch, and W. Ehrfeld, Kernforschungszentrum Karlsruhe