The Development of a Molded Array SMCSP Package Using High-Densi September 2001 The Development of a Molded Array SMCSP Package Using High-Density Type Lead Frame Sang Kyun Lee, Han Gyu Kim, Bong Hi Lee, and Kwang Suck Park, Precision Instrument R&D Center, Samsung Techwin Company, Ltd. $60.00 – Purchase Checkout Added to cart
