September 2001
The Development of a Molded Array SMCSP Package Using High-Density Type Lead Frame
Sang Kyun Lee, Han Gyu Kim, Bong Hi Lee, and Kwang Suck Park, Precision Instrument R&D Center, Samsung Techwin Company, Ltd.
The Development of a Molded Array SMCSP Package Using High-Density Type Lead Frame
Sang Kyun Lee, Han Gyu Kim, Bong Hi Lee, and Kwang Suck Park, Precision Instrument R&D Center, Samsung Techwin Company, Ltd.