Half Etch Technology for Fine Line Processing

HOI (High Density Interconnects) and ultra fine lines are becoming more and more popular. The use of ultra thin foils is the only feasible way to produce ultra fine lines in a production environment. Half etching (copperreduction) is the easiest and most economical way to produce thin foils. This paper will discuss the half etching process, the equipment used for the process, testing results, and the advantages of that etching.