High Density Circuit Roadmap for Electronic Packaging Materials

Historically, during the 1960s to the 19705, most semiconductors were packaged in DIP (Dual lnline Packages), and they were mounted on rigid circuit boards (Figure 1). The bare dies were mounted on lead frames and connected by wire bonding. The component leads were inserted in the through holes of the circuit boards and soldered at the other side of the boards.


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