High Resolution Dry Film Imaging for Photochemical Machining

Most current dry film photoresists are capable of achieving accurate 3 mil line and space imaging resolution, when using modem processing equipment and careful process control. Certain special dry film types can resolve geometries down to as little as 1 mil lines and spaces. Thus, the major limiting factors in producing high resolution images with dry film have proven to be process-related, not photographic limitations in the dry film itself. Specifically, use of equipment capable of high intensity exposure and high impact spray development is particularly important.